Interview with Frank Altmann

The “Materials and Electronic Components” business unit focuses on improving the reliability and functionality of microelectronics components and systems. It offers innovative solutions in microstructural analysis, material characterization, and failure diagnostics. Key applications include automotive electronics, power electronics, and sensor technology. The main priorities are quality assurance and failure diagnostics for industry, as well as the development of new analytical methods and research into new conductive materials and packaging materials.

In your view, what were the success stories of the past year that illustrate the concrete benefits of your research work for customers?

One activity that shaped the entire year is our participation in the European pilot line APECS. Here, we are responsible for a work package that focuses on characterization, testing, and reliability. These aspects are central to guiding the development of highly complex heterogeneous components in APECS toward success and market readiness. We contribute internationally recognized expertise and state-of-the-art equipment to this effort. This enables us to provide well-founded support for the process development and technology lines of our partners and the industry, and to derive reliable conclusions regarding the operational suitability and reliability of electronic components. In this way, we help minimize the risk of failure, shorten development times, and ensure product quality in a targeted manner.

Another highlight for me was our CAM workshop, where we were able to discuss current issues in fault diagnostics in microelectronics with many high-ranking international guests. In addition, we have completed several major projects, for example, also in collaboration with other business units of the institute, to improve the reliability and service life of inverters in renewable energy systems.

In which areas are you seeking cooperation partners and clients? How do you work with them to create added value?

On the one hand, we offer expert support in the implementation of new solutions in microelectronics, such as the use of new materials or material combinations that require comprehensive qualification. In this way, we accelerate development processes and make new approaches suitable for reliable practical application. On the other hand, we can quickly and precisely identify faults and defects in electronic components throughout the manufacturing chain, particularly when investigating the causes of field returns. Here, we can identify complex failure scenarios and degradation mechanisms and recommend measures to our clients on how to improve the design and processing accordingly. This also helps optimize yield in series production and ensure reliability in application.

Many of our customers come from the automotive electronics sector, but we also apply our expertise to other industries, such as communications or energy technology. We have extensive experience in understanding our customers’ needs and developing customized, flexible solutions.

What developments are on the horizon to further expand the business unit’s offerings in the future?

APECS will remain a very important topic for us in 2026 as well. As part of the pilot line, we will be able to commission additional new equipment, enabling an even better offering for our customers. In terms of content, digital solutions will also remain in demand, such as those we are currently developing in the “FA2IR” project, for example. Applying our methods to new fields of application, such as those intersecting with photonics, also presents exciting challenges for the future. I am very much looking forward to the exchange during our CAM workshop. Furthermore, we are involved in organizing the “FIRST” conference, a new strategic trend forum for Europe’s semiconductor ecosystem, where issues of quality and reliability will also play an important role.