Recent research - Fraunhofer IMWS

15.12.2025

Taming AI's hunger for data: Using the smallest technology nodes for energy-efficient solutions

Artificial intelligence works fast, but its energy consumption is growing rapidly. A German-Taiwanese research team is now developing a solution: new memory for leading chip technologies smaller than 3 nm. With a joint research program, Fraunhofer IPMS, Fraunhofer IMWS, and the Taiwanese research institute TSRI are laying the foundation for the next generation of energy-efficient AI chips.

MORE INFO

26.11.2025

Fraunhofer IMWS strengthens materials research with new high-performance microscopes

With two new high-performance microscopes, the Fraunhofer IMWS in Halle (Saale) is expanding its capabilities for investigating materials down to the atomic level. The innovative devices, including the first scanning transmission electron microscope (STEM) of its kind in Europe, were officially put into operation today.

MORE INFO

27.10.2025

Quality and reliability for hybrid bonding through powerful analysis methods

The novel connection technology of hybrid bonding enables up to several million highly miniaturized electrical contacts between individual microelectronic components.

MORE INFO

23.10.2025

Protection concept for renewable energies: New solutions for safe IGBT/SiC inverters

Conventional shutdown methods are often no longer able to adequately protect new types of systems with semiconductor inverters and high power density. The GreenGridGuard project has developed an innovative, semiconductor-based protection concept.

MEHR INFO

27.6.2025

Know-how for microstructure and failure diagnostics: Fraunhofer IMWS supports EU pilot line for innovative electronics

Strengthening the European electronics industry through targeted support for innovative technologies and advanced manufacturing processes: This is the aim of the pilot line for "Advanced Packaging and heterogeneous Integration for Electronic Components and Systems" (APECS).

MORE INFO

25.6.2025

Design tools for improved hardware security of RFETs

Novel reconfigurable field effect transistors (RFETs) enable significantly better protection against hardware attacks and are the focus of the "DI-ReDesign" project.

MORE INFO

23.1.2025

Faster, higher comparability and increased precision in the failure analysis of microelectronic components through the use of AI

In the "FA2IR" project, the Fraunhofer IMWS in Halle (Saale) is working with partners on solutions to develop and incorporate sophisticated digital tools for paving the digital path for fault analysis. Automated, AI-supported analysis is intended to minimize result-subjectivity, shorten development times and to improve product quality.

MORE INFO

16.1.2025

Robust converters for renewable energy generation

In the recently completed project “Reliable converters for renewable energy supply (power4re)”, five institutes of the Fraunhofer-Gesellschaft, including the Fraunhofer IMWS, have developed significantly improved solutions.

MORE INFO

22.10.2024

Improved methodology for predicting the reliability of PV and battery inverters

In the “Reliability Design” project, the Fraunhofer Institute for Microstructure of Materials and Systems IMWS has supported the development of more precise methods for lifetime predictions.

MORE INFO

Sebastian Brand and Michael Kögel honored with Outstanding Researcher Award from Intel

For their work on increasing the sensitivity and 3D resolution of microscopic lock-in thermography analysis, the two scientists Dr. Sebastian Brand and Michael Kögel from the Fraunhofer Institute for Microstructure of Materials and Systems IMWS in Halle (Saale) have received one of the "Outstanding Researchers Award 2023" from Intel Corporation.

MEHR INFO