Power electronics for H2 applications


  • Failure diagnosis and microstructure analysis of connection materials 
  • Characterization and failure analysis of electronic components and systems
  • Advice on complex failure phenomena
  • Material interaction analyses for level 2 reliability
  • Material characterization and degradation of insulating and encapsulation materials
  • Modeling and simulation of mechanical, thermal and thermomechanical properties

Research infrastructure

  • Comprehensive failure analysis techniques suitable for housed components and integrated assemblies
  • High-resolution analytics and trace analysis (SEM/EDX, FIB, (S)TEM/EDX, TOFSIMS, ...)
  • Thermo-mechanical material characterization 
  • FEM modeling and simulation

Reference projects