Fraunhofer Institute for Microstructure of Materials and Systems IMWSThe determination of the separation or peel resistance refers to the evaluation of the resistance of a bond or layer to separation or peeling. This test is particularly relevant in component testing when components or materials are bonded and the adhesive strength between them is important. The separation or peel resistance test can be performed at Fraunhofer IMWS in various ways, depending on the type of bond or layer.
Common methods:
Peel resistance test
This method is used to evaluate the adhesive strength of an adhesive bond. A tensile force is applied to the adhesive bond to measure the peel force required to separate the layer or material.
Peel test with tapes
This method is commonly used in the testing of adhesive tapes. The tape is attached to a surface at one end and then pulled off at a constant peel speed. The peel force is measured to determine the peel resistance.
Separation test
This method is used to evaluate the adhesive strength between two materials. The materials are pulled apart with a specific load or tensile force to measure the separation resistance.