3D printed highly thermally conductive copper components as high-performance heatsinks

In a new project Fraunhofer Institute for Microstructure of Materials and Systems IMWS together with the copper semi-finished products manufacturer KME, are going to explore the use of additive manufacturing technologies for highly thermally conductive components made of copper and copper alloys.

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Michael Kögel from the Fraunhofer IMWS honored at ISTFA 2019

For his work “Machine learning assisted signal analysis in Acoustic Microscopy for non-destructive defect identification” Michael Kögel from the Fraunhofer Institute for the Microstructure of Materials and Systems IMWS in Halle (Saale) received the prize for the “Attendees‘ Best Paper” awarded by the international symposium ISTFA 2019 in Portland/USA.

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Power semiconductors made of gallium nitride can help improve energy efficiency

Energy-efficient chips based on the semiconductor material gallium nitride (GaN) are being developed by 26 partners from nine European countries in the project UltimateGaN. The Fraunhofer Institute for the Microstructure of Mate-rials and Systems IMWS in Halle (Saale) is one of the project’s partners, sharing its know-how in error diagnostics and the development of analytical methods. At a meeting held in Lausanne the project partners presented their first results.

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Sandy Klengel honored for an “Outstanding Paper” at the European Microelectronics and Packaging Conference EMPC

Sandy Klengel from the Fraunhofer Institute IMWS was honored for an “Outstanding Paper” at the European Microelectronics and Packaging Conference (EMPC) in Pisa. She received the award for her research into the effect of copper wire material on corrosion-resistant packaging and systems for high temperature applications, organized in cooperation with the Nippon Micrometal Corporation in Japan.

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Fraunhofer IMWS wins awards at the world’s leading electronics conference held in Las Vegas

Better ways to operate power electronic components at particularly high temperatures and a new procedure for the non-destructive assessment of their joining layers: For these discoveries, experts from the Fraunhofer Institute for Microstructure of Materials and Systems IMWS received awards at the Electronic Components Technology Conference (ECTC) in Las Vegas.

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Fraunhofer IMWS supports European research project Power2Power

3 partners from eight countries are researching and developing innovative power semiconductors with more power density and energy efficiency: With this goal, the European research project Power2Power, which has a duration of three years and is coordinated by Infineon Technologies Dresden GmbH & Co. KG, has just begun.

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Faster recognition of susceptibility to corrosion – Fraunhofer IMWS develops a reliable test method

Materials in electronic components are exposed to corrosive processes due to environmental conditions such as dampness, temperature and pollution. Corrosion – also the materials reaction to its environment – usually occurs locally and results in components and systems being significantly affected; this increasingly is the cause of failure of electronic components.

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Electronics

Abriss Diagnostik Erkennung Ebene
© Fraunhofer IMWS
Cracking in a microchip contact, can only be detected under the microscope.

Our Business Unit “Electronic Materials and Components” investigates components, systems and materials of electronics and microsystem engineering, for example integrated semiconductor circuits, sensors, electronic components and assemblies. These are analyzed and tested comprehensively, in order to understand the relationship between technological process and application conditions  with microstructure and material properties as well as with the affected functional performance in detail. For the benefit of our costumers, we master complex, powerful methods that include non-destructive analytics, high-resolution methods of electron microscopy and solid-state spectroscopy, surface and trace analysis methods, and mechanical material characterization that includes modeling and numerical simulation.

Major areas of our work are the process characterization on a microstructural level complementing the introduction of innovative technologies as well as the fast and client-focused root cause analysis of faults and of defect formation. The results are incorporated into the clients’ manufacturing processes and thus help to increase the quality and reliability of these systems.

Our clients and partners are mainly from the automotive electronics supplier chain, but also from communications technology, the optics, medical and consumer industry, power electronics for energy and industrial engineering and the segment of equipment suppliers for microstructure diagnostics and testing.

 

In our research projects with partners from industry or publicly funded projects we investigate electronic components along the entire production chain from wafer to the assembly in the end application.

Semiconductor wafers and chips (IC, sensors, power electronics, optoelectronics) of Si technologies, GaN and SiC

Materials and components of packaging and connection technology, power electronics modules

Electronic assemblies and systems, e.g. in automobile applications

 

Our services are focused on:

Process characterization by means of microstructural analysis in electronics development, especially supporting the introduction of innovative systems engineering and new materials

Complex failure diagnostics for field returns, tracking of causes of faults in qualification or in production

Further development of methods, equipments and procedures for quality control, testing and defect analysis