Novel method for characterizing nanometer-sized defects in GaN semiconductors

The Fraunhofer IMWS along with 79 partners from 14 countries have joined forces in the EU-funded project "iRel 4.0" (Intelligent Reliability 4.0) to find solutions to improve the reliability of electronic components and systems along the entire value chain.



Experts Discuss New Trends and Approaches in Microelectronics

At this year's tenth CAM workshop international experts from the electronics industry and analytical equipment manufacturers will discuss technological challenges, new approaches and future requirements in failure analysis and material characterization of electronic components and systems.



Power semiconductors made of gallium nitride

In the EU-funded project "UltimateGaN", 26 partners from nine European countries conducted joint research on the next generation of gallium nitride (GaN)-based power semiconductors.



Research factory for quantum and neuromorphic computing launched

The project aims to advance microelectronic research and development for novel computing technologies such as quantum and neuromorphic computing and accelerate their transfer to industrial applications.



Reliable polymer cases for the protection of power electronic components

In a joint research project Werkzeugbau & Kunststofftechnik Kruse GmbH (WBKT) and the Fraunhofer IMWS have set themselves the goal of developing highly reliable polymer cases for power electronics components that are suitable for series production.



Robust sensor for harsh environmental conditions

Sensors that function reliably even at extremely high temperatures or in corrosive environments are in demand, for example, for use in energy technology. In a new joint project, the Fraunhofer IMWS is contributing its expertise in materials analysis and has developed new possibilities for materials characterization in the high-temperature range.



Data platform to increase efficiency, productivity and sustainability on copper alloy materials

The Fraunhofer IMWS wants to provide a platform with data on copper alloy materials along the entire life cycle together with partners.  



Power electronics for offshore wind turbines

Together with partners, the Fraunhofer IMWS has developed an approach for significantly more robust power electronics components for use in offshore wind turbines from the chip to the system level.



3D printed highly thermally conductive copper components as high-performance heatsinks

In a new project Fraunhofer IMWS together with the copper semi-finished products manufacturer KME, are going to explore the use of additive manufacturing technologies for highly thermally conductive components made of copper.



Research project launched to increase the reliability of converters

The research project »power4re« started with a virtual kick-off in mid-April. Five institutes of the Fraunhofer-Gesellschaft are working together with industry representatives on solutions to increase the reliability and robustness of inverters in photovoltaic systems and frequency converters in wind turbines.



Power semiconductors made of gallium nitride as a contribution to greater energy efficiency

Energy-saving chips based on the new semiconductor material gallium nitride (GaN) are being further developed by 26 partners from nine European countries in the »UltimateGaN« project.


Fraunhofer IMWS wins awards at the world's leading electronics conference

Two of the four research awards of the world's leading conference for assembly and connection technologies in electronics went to Halle (Saale).


Faster recognition of susceptibility to corrosion

Fraunhofer IMWS researchers are working on a more efficient test method to predict the corrosion behaviour of electronic components.


New evaluation criteria for heavy wire bond contacts

Fraunhofer researchers define new evaluation criteria for bonding contacts in chips.


Safe electronics for autonomous driving

Fraunhofer CAM has a leading role in its contribution to making vehicle electronics safe and long lasting.


New test methods for cover materials

How do defects form in thermoplastic cover materials and how does this impact on electronic components? A project at Fraunhofer IMWS wants answers.


»Automated driving can save lives«

Autonomous driving offers enormous advantages for more safety in road traffic. Berthold Hellenthal of Audi explains why reliable electronic components are so...


Thin, thinner, ultrathin

Specimens examined in the electron microscope have to be particularly thin. A device has been developed at the Fraunhofer IMWS, which makes such samples quickly and precisely.


A TITAN for the smallest insights

The transmission electron microscope TITAN has very high imaging quality: It can even make individual atoms visible.


What does joint equipment development achieve?

The Fraunhofer IMWS also develops test equipment. Matthias Petzold explains advantages for clients.