Highlights

In a new project Fraunhofer Institute for Microstructure of Materials and Systems IMWS together with the copper semi-finished products manufacturer KME, are going to explore the use of additive manufacturing technologies for highly thermally conductive components made of copper and copper alloys.

Energy-saving chips based on the new semiconductor material gallium nitride (GaN) are being further developed by 26 partners from nine European countries in the »UltimateGaN« project. The Fraunhofer IMWS is one of the project partners and is contributing its expertise in fault diagnostics and in the development of analytical methods. The project partners presented the first results at a meeting in Lausanne.

Fraunhofer IMWS researchers are working on a more efficient test method to predict the corrosion behaviour of electronic components.

Autonomous driving offers enormous advantages for more safety in road traffic. Berthold Hellenthal of Audi explains why reliable electronic components are so...