3D printed highly thermally conductive copper components as high-performance heatsinks

In a new project Fraunhofer Institute for Microstructure of Materials and Systems IMWS together with the copper semi-finished products manufacturer KME, are going to explore the use of additive manufacturing technologies for highly thermally conductive components made of copper and copper alloys.



Research project launched to increase the reliability of converters

The research project »power4re« started with a virtual kick-off in mid-April. Five institutes of the Fraunhofer-Gesellschaft are working together with industry representatives on solutions to increase the reliability and robustness of inverters in photovoltaic systems and frequency converters in wind turbines.



Power semiconductors made of gallium nitride as a contribution to greater energy efficiency

Energy-saving chips based on the new semiconductor material gallium nitride (GaN) are being further developed by 26 partners from nine European countries in the »UltimateGaN« project. The Fraunhofer IMWS is one of the project partners and is contributing its expertise in fault diagnostics and in the development of analytical methods. The project partners presented the first results at a meeting in Lausanne.


Fraunhofer IMWS wins awards at the world's leading electronics conference

Two of the four research awards of the world's leading conference for assembly and connection technologies in electronics went to Halle (Saale).


Faster recognition of susceptibility to corrosion

Fraunhofer IMWS researchers are working on a more efficient test method to predict the corrosion behaviour of electronic components.


New evaluation criteria for heavy wire bond contacts

Fraunhofer researchers define new evaluation criteria for bonding contacts in chips.


Modern glass with fingerprint

The Fraunhofer IMWS is working with partners on innovative markings for glass. The aim is to make the marking durable and easily visible.


Safe electronics for autonomous driving

Fraunhofer CAM has a leading role in its contribution to making vehicle electronics safe and long lasting.


New test methods for cover materials

How do defects form in thermoplastic cover materials and how does this impact on electronic components? A project at Fraunhofer IMWS wants answers.


Energy-saving chips of the future

Semiconductors based on gallium nitride convert electricity more efficiently than conventional chips made of silicon. The IMWS helps to make them market ready.


»Automated driving can save lives«

Autonomous driving offers enormous advantages for more safety in road traffic. Berthold Hellenthal of Audi explains why reliable electronic components are so...


Thin, thinner, ultrathin

Specimens examined in the electron microscope have to be particularly thin. A device has been developed at the Fraunhofer IMWS, which makes such samples quickly and precisely.


A TITAN for the smallest insights

The transmission electron microscope TITAN has very high imaging quality: It can even make individual atoms visible.


What does joint equipment development achieve?

The Fraunhofer IMWS also develops test equipment. Matthias Petzold explains advantages for clients.


Website of the Fraunhofer CAM

All information on the Fraunhofer Center for Applied Microstructure Diagnostics can be found on the CAM’s website.