Physical failure analysis

Integrated circuits on silicon substrates are used today in almost every electronic device we come across in our everyday lives. Future technologies such as autonomous driving, electromobility or the internet of things require increasingly powerful and complex electronic components and systems. In addition to progressive miniaturization and the associated increase in performance and cost efficiency, the increase in robustness, especially for critical applications, also play an important role.

The constantly growing complexity of systems and the increasing demands on service life and reliability pose new challenges for quality assurance and the structural analysis necessary for it.

We support and accompany our partners:

• with our in-depth expertise in the area of silicon technology
• in the selection of the right methodology for targeted failure analysis
• in the complex material and defect characterization of electronic components from the application areas automotive, RF and power electronics
• in the development of preparation methods based on focused ion beams (FIB)
• by quickly and purposefully addressing their problems

We increase the reliability and robustness of products, thereby improving cost efficiency and supporting our customers in optimizing application-oriented manufacturing processes.